RS-2

The RS series, which meets diverse needs with both flexibility and efficiency, represents a further innovation.
Achieves high-speed mounting of 50,000 CPH, equipped with a high-quality laser-crafted HEAD.
Highly versatile, suitable for components ranging from very small to large; a single device can handle all production categories, bringing new value to the production site.

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SMT

Keyword： RS-2

Detailed Introduction Video Data Download

High-speed Intelligent Modular Chip Mounter RS-2
Substrate Size	Minimum		50mm x 50mm
	Maximum	1 Buffer	800mm x 370mm
		3 Buffers	410mm x 370mm
Allowed Substrate Weight			Maximum 3kg
Substrate Thickness			0.3~6.0mm
Maximum Component Height			25mm
Component Size			03015~50mm ×150mm (1×3 times recognition) 74mm (2×2 times recognition)
Component Mounting Speed	Under Optimal Conditions		50,000 CPH
	IPC9850		32,000 CPH
Component Mounting Accuracy			±35μm (Cpk≥1)
Maximum Number of Component Types Mounted			112 types* ¹
Power Supply			Three-phase AC 200V (Standard Specification) / Three-phase AC 200V ~ 415V (Transformer Specification Optional)
Rated Power			2.2 kVA
Air Pressure Used			0.5±0.05 MPa
Maximum Air Consumption (Standard Condition)			When using vacuum generator: 200L/min (standard), when using vacuum pump: 50L/min (optional)
Overall Dimensions (WxDxH)2			1,500mm × 1,686mm × 1,450mm
Machine Weight			Approx. 1,630kg

1. When using RF feeder (RJF⁰8AS)
2. The depth D in the overall dimensions does not include the front operation display screen, and the height H does not include the signal lamp.